1.93W/m-k HY510 10g/20g Silicone Thermal Paste Heat Transfer Grease Heat Sink CPU GPU Chipset Notebook Computer Cooling Syringe

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Product description Hy510 gray thermal conductive silicone grease, this kind of silicone grease is added with high thermal conductivity graphite powd…

Selected Color is 1pcs HY510 10g (black)
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1.93W/m-k HY510 10g/20g Silicone Thermal Paste Heat Transfer Grease Heat Sink CPU GPU Chipset Notebook Computer Cooling Syringe

$0.85

1.93W/m-k HY510 10g/20g Silicone Thermal Paste Heat Transfer Grease Heat Sink CPU GPU Chipset Notebook Computer Cooling Syringe

$0.85
6 customers are viewing this product
Description
Product description

Hy510 gray thermal conductive silicone grease, this kind of silicone grease is added with high thermal conductivity graphite powder, metal powder and other substances to achieve better thermal conductivity effect. This product is widely used in gap filling between CPU and radiator, high-power diodes, triodes, silicon controlled elements, heat transfer at the slit in contact with the substrate. With the help of the high thermal conductivity of graphite, graphite thermal conductive silicone grease can fill the gap between IC or triode and heat sink, increase the contact area between them, and achieve good heat dissipation effect.

The products have passed the SGS environmental certification and meet the EU ROHS testing standards. The variety of packaging is convenient for customers to choose and use.

1.93 w / m-K;

It has strong insulation performance and can withstand voltage above 10000 v;

Low thermal resistance, keep the paste state for a long time;

Wide working temperature range, stable performance at - 30 ℃ - 280 ℃;

High heat dissipation performance, cost-effective


Product parameters

Project hy510 unit

Color ﹣ gray ﹣ no

Thermal conductivity > 1.93 w / m-k

Thermal impedance < 0.225 c-in 2 / W

Specific gravity > 2 g / cm 3

Viscosity ﹥ 1000 ﹥ no

The concentration is less than 380 ± 10 1 / 10 mm

Instantaneous temperature resistance - 50 ~ 300 ℃

Working temperature - 30 ~ 280 ℃

component

Silicon compounds < 50%

30% of carbon compounds

Metal oxide compounds 20%




Product application

High heat conduction demand module

Cooling device to chassis or frame

High speed large memory driver

Automobile engine control

Hard disk drive and DVD drive

Power conversion equipment

High power LED

Laptops and desktops

Network communication equipment

Household appliances, electronic components, electricians, etc


How to use the product

1. Clean the surface of CPU core and radiator first, and the surface is clean and oil-free.

2. Determine the contact area between the heat sink and the CPU, lift half a grain of thermal conductive silicone grease with a scraper and transfer it to the CPU core, and then wipe it evenly with a scraper to make the thermal conductive silicone grease at the bottom of the radiator evenly cover the whole contact area with the CPU. The thickness of the thermal conductive silicone grease is about the thickness of an ordinary paper.


3. Make sure that there is no foreign matter on the surface of the radiator base and CPU core. Put the radiator on the CPU. At this time, you can only press it lightly, and cannot rotate or translate the radiator. Otherwise, the thickness of thermal conductive silicone grease between radiator and CPU may be uneven.


4. Fasten the fastener and finish the work.


Product storage

Store at room temperature

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